Abstract: Fan-out wafer-level packaging (FOWLP) addresses the demand for higher interconnect densities by offering reduced form factor, improved signal integrity, and enhanced performance. However, ...
Abstract: During normal operation of GaN-based converters, GaN devices maintain high junction temperatures (TJ) while being affected by dynamic on-resistance (RON). Therefore, evaluating the dynamic ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results