Advanced packaging has created new process bottlenecks related to the internal mechanics of the packaging equipment. As ...

When a multi-die package worth $500 fails final test because of a defect that originated three process steps earlier, the economics of advanced packaging become painfully clear. Each excursion carries ...

Wafer bumps need to be uniform in height to facilitate subsequent manufacturing steps, but a push for 100% inspection in packaging in mission-critical markets is putting a strain on existing ...

Rising Demand for Integrated Packaging Solutions The confectionery industry is undergoing a transformation driven by changing consumer preferences, retail expansion, and stricter quality standards.

The role of packaging/assembly/test (P/A/T) in the overall successful commercialization of MEMS (microelectromechanical systems) has historically taken a backseat to device development. In the ...