TE Connectivity recently unveiled a new series of NanoRF modules and contacts that the company claims provide twice the density of standard VITA 67 RF modules for VPX embedded computing applications.
NXP Semiconductors has claimed the industry’s first top-side cooling solution for RF power, which reduces the thickness and weight of 5G radios by more than 20 percent. The new family of top-side ...
Members can download this article in PDF format. In this design idea, you will learn how to interface two PIC microcontrollers using a wireless 433-MHz RF transmitter/receiver pair to control up to ...
“Worldwide adoption of fourth-generation wireless (4G) long-term evolution (LTE) smartphones and the actual transition to fifth-generation wireless (5G) is the main driving engine for semiconductor ...
Chipmaker Broadcom Inc. today debuted four RF front-end modules for powering routers that use Wi-Fi 7, a new wireless networking standard. The company says its modules can also be used to build Wi-Fi ...
The QPF5001 X-band FEM incorporates a power amplifier, low-noise amplifier (LNA), and limiter. Half the size of a discrete component implementation, the MCM targets the 8- to 12-GHz X-Band. The ...
As Wi-Fi expands into the 6GHz band and the new Wi-Fi 7 standard develops, and unprecedented technology complexity and challenges are emerging in the way signals are implemented, Qualcomm Technologies ...
Apple reportedly will continue developing its own mmWave AiP (antenna in package) modules for its next-generation iPhone lineup, with related efforts likely to push the US handset brand moving forward ...
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