Business Wire

Hprobe Announces New Generation of Magnetic Test Head for Wafer Sort of MRAM in Mass Production

GRENOBLE, France--(BUSINESS WIRE)--Hprobe, a provider of turnkey semiconductor Automatic Test Equipment (ATE) for magnetic devices, today announced a breakthrough magnetic test head revolutionizing ...
Digi Times

ADLINK high-efficiency die sorting machine solution increases effectiveness of IC packaging and testing

The back-end semiconductor manufacturing process refers to the IC packaging and testing that people often hear about. Specifically, the process known as chip probing (CP) is conducted to test the ...
EDN

Contactless Testing Wafer Testing

STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, announced the successful production of the world’s first semiconductor wafer whose ...
pv magazine International

Longi, ANU develop gettering-based process to improve n-type wafer quality

The Chinese module maker and the Australian National University utilized phosphorus diffusion gettering and another defect mitigation strategy to improve the quality of n-type wafers. The proposed ...
EDN

STMicroelectronics Produces World’s First Wafer Employing Fully Contactless Testing

Geneva, December 14, 2011 STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, today announced the successful production of ...