Detecting macro-defects early in the wafer processing flow is vital for yield and process improvement, and it is driving innovations in both inspection techniques and wafer test map analysis. At the ...

Variation is becoming a bigger problem in multi-die assemblies with TSVs and hybrid bonding. Multi-modal approaches are required to test these devices. AI plays a role in improving defect capture rate ...

Defect engineering is the deliberate introduction, removal, or manipulation of structural imperfections in nanomaterials to tailor their properties for specific applications. Unlike the traditional ...