DIGITIMES

Hanwha Semitech to supply FO-PLP equipment for SpaceX-linked chip production

South Korean semiconductor equipment maker Hanwha Semitech is reportedly preparing to supply fan-out panel-level packaging ...
Seeking Alpha

ACM Research Delivers First Horizontal Panel Electroplating Tool Strengthening Its Leadership in Fan-Out Panel-Level Packaging

SEMICON EUROPA, Munich, Nov. 16, 2025 (GLOBE NEWSWIRE) -- ACM Research, Inc. (ACMR) (“ACM”) (NASDAQ: ACMR), a leading supplier of wafer and panel processing solutions for semiconductor and advanced ...
Semiconductor Engineering

The Opportunities And Challenges Of FOPLP Technology

The advanced packaging architecture designed for AI and high-performance computing (HPC) applications involves positioning memory in close proximity to AI processors, such as GPUs and AI ASICs, on a ...
Digi Times

Analysis: Taiwan's two major panel makers enter semiconductor packaging; CPO and FOPLP become key

Optical communication technology is shifting from traditional pluggable optics toward co-packaged optics (CPO) architectures. Advanced packaging technologies are extending from wafer-level to ...