Apple is expected to use TSMC's new 2nm process and SoIC-X (System on Integrated Chip) advanced packaging technology in the second half of 2025, according to new reports. AMD was the first to adopt ...

Apple Inc. today announced that it will become the first and largest customer of a $2 billion chip packaging facility Amkor Technology Inc. is building in Arizona. The facility will process chips that ...

TL;DR: Apple has ordered next-gen M5 chips from TSMC for iPad Pro and Macs, with production in 2H 2025. The M5 chips will use TSMC's 3nm process and SoIC technology for better thermal management, with ...

Apple has begun mass production of its next-generation M5 series chips for key products such as the next-generation Mac and iPad, according to the Korean media outlet ETNEWS. The M5 lineup includes ...

As part of new environmental efforts announced on Tuesday, Apple said it will cut down on the material used in iPhone 13's packaging by removing the outer plastic wrap that typically enshrines the ...

The A20 chip that will be used in the iPhone 18 could be packaged with a new tech that will give Apple more configuration options, while still being as small as possible. Apple's chips, produced by ...