WEST LAFAYETTE, Ind. – Purdue University is working toward the future in microelectronic product development with the creation of the Institute for Advanced System Integration and Packaging (ASIP) to ...

WEST LAFAYETTE, Ind. — Purdue University will recognize the impact of alumnus and semiconductor pioneer John Atalla with the naming of the newest system integration and packaging research institute on ...

KISSIMMEE, Fla.--(BUSINESS WIRE)--BRIDG, a not-for-profit, public-private partnership specializing in advanced system integration and packaging, today announced the U.S. Department of Defense-funded ...

Add Yahoo as a preferred source to see more of our stories on Google. Broadcom Inc. has unveiled its revolutionary 3.5D eXtreme Dimension System in Package (XDSiP) platform, designed to empower ...

As device scaling slows down, a key system functional integration technology is emerging: heterogeneous integration (HI). It leverages advanced packaging technology to achieve higher functional ...

The terms “chiplet” and “heterogeneous integration” fill news pages, conference papers, and marketing presentations, and for the most part engineers understand what they’re reading. But speakers ...

GCL System Integration (GCL SI) joined partners and stakeholders at Getz Energy’s “Getz Energy Open House: Welcome to the Smart Energy Revolution” to explore trends in large-scale solar deployment and ...