TSMC has spent years guarding its most advanced chip packaging technology, building out capacity internally and keeping the ...

Amkor (AMKR) as an AI supply-chain chokepoint: low 2.35x fwd revenue, strong growth, packaging margins, 2028–30 targets, ...

ASE Technology Holding Co., Ltd. (NYSE:ASX) is one of the 15 Most Promising Stocks to Buy Right Now. On May 26, 2026, ASE ...

TEMPE, Ariz.--(BUSINESS WIRE)-- Amkor Technology, Inc. (Nasdaq: AMKR), a leading provider of semiconductor packaging and test services, in collaboration with the Trump Administration, today announces ...

Amkor Technology's HDFO CPU packaging ramp and rising AI demand can nearly triple advanced packaging volumes in 2026 as compute growth accelerates.

By Wen-Yee Lee TAIPEI, May 29 (Reuters) - Taiwan chip designer MediaTek said on Friday it supports both TSMC's and Intel's ...

TAICHUNG, Taiwan (Reuters) - Nvidia's demand for advanced packaging from TSMC remains strong though the kind of technology it needs is changing, the U.S. AI chip giant's CEO Jensen Huang said on ...

ASE Technology is positioned for robust growth, driven by its LEAP segment amid surging AI and data center demand. Read more on ASX stock here.

USI, a global leader in electronic design and manufacturing services, today announced a breakthrough in advanced power semiconductor packaging technology designed for next-generation power solutions.

As advanced packaging technologies and large-size integrated substrate solutions become key development areas for technology firms, glass substrate technology has emerged as a focal point, attracting ...