Purdue University is working toward the future in microelectronic product development with the creation of the Institute for Advanced System Integration and Packaging (ASIP) to enable faster designing ...

Heterogeneous integration refers to the assembly of disparate semiconductor components—such as logic, memory and analogue dies—into a unified package, leveraging advanced interconnect and ...

Advanced packaging options continue to stack up in the pursuit of “More than Moore” and higher levels of integration. It has become a place where many high-density interconnects converge, and where ...

SINGAPORE, Feb. 3, 2026 /PRNewswire/ -- FIC Global, Inc. (TWSE: 3701; FICG), with PRIME Technology as its optical communications brand, will participate in Asia Photonics Expo (APE) 2026, taking place ...

Skymizer, an AI inference infrastructure company and creator of the HyperThought™ LPU platform, today announced a strategic collaboration with VIA NEXT Technologies, a leading provider of system-level ...

This Collection supports and amplifies research related to SDG 7 - Affordable and Clean Energy. This Scientific Reports Collection welcomes original research on Advanced 3D packaging and integration.

3D IC chiplet-based heterogeneous package integration represents the next major evolution in semiconductor design. It allows us to continue scaling system performance despite the physical limitationA ...

Companies to collaborate on R&D to accelerate introduction of advanced packaging technologies for next-generation AI chips and systems ...

The 2026 IEEE Electronic Components and Technology Conference (ECTC) showcased how advanced packaging can redefine the scalability limits of artificial intelligence (AI) and high-performance computing ...

Key Points Interested in Applied Materials, Inc.? Here are five stocks we like better. Applied Materials says the AI boom is ...

ASE Technology is positioned for robust growth, driven by its LEAP segment amid surging AI and data center demand. Read more on ASX stock here.