Purdue University is working toward the future in microelectronic product development with the creation of the Institute for Advanced System Integration and Packaging (ASIP) to enable faster designing ...

Heterogeneous integration refers to the assembly of disparate semiconductor components—such as logic, memory and analogue dies—into a unified package, leveraging advanced interconnect and ...

Advanced packaging options continue to stack up in the pursuit of “More than Moore” and higher levels of integration. It has become a place where many high-density interconnects converge, and where ...

Skymizer, an AI inference infrastructure company and creator of the HyperThought™ LPU platform, today announced a strategic collaboration with VIA NEXT Technologies, a leading provider of system-level ...

As semiconductor devices continue advancing into more sophisticated packaging schemes, traditional optical inspection technologies are brushing up against physical and computational boundaries. The ...

SINGAPORE, Feb. 3, 2026 /PRNewswire/ -- FIC Global, Inc. (TWSE: 3701; FICG), with PRIME Technology as its optical communications brand, will participate in Asia Photonics Expo (APE) 2026, taking place ...

KAOHSIUNG, April 15, 2026 /PRNewswire/ -- E&R Engineering Corp. (8027.TW), a leading provider of innovative semiconductor process equipment, will participate in the International Semiconductor ...

ASE Technology is positioned for robust growth, driven by its LEAP segment amid surging AI and data center demand. Read more on ASX stock here.

Key Points Interested in Applied Materials, Inc.? Here are five stocks we like better. Applied Materials says the AI boom is ...

Advanced Semiconductor Engineering, Inc. (ASE), a member of ASE Technology Holding Co., Ltd. (NYSE: ASX, TAIEX: 3711) and a ...