Nasdaq

Ansys Multiphysics Solutions Certified By TSMC For High-Speed Next-Generation 3D-IC Packaging Technologies

Ansys (NASDAQ: ANSS) achieved certification of its advanced semiconductor design solution for TSMC's high-speed CoWoS® with silicon interposer (CoWoS®-S) and InFO with RDL interconnect (InFO-R) ...
Seeking Alpha

Ansys Enables 3D Multiphysics Visualization of Next-Generation 3D-IC Designs with NVIDIA Omniverse

Existing Ansys capabilities with NVIDIA Omniverse platform supercharge 3D integrated circuit (3D-IC) design by enabling designers to optimize semiconductor chips within the context of a ...
Reading Eagle

Ansys Multiphysics Solutions Achieve Certification for TSMC’s N3 and N4 Process Technologies

Ansys (NASDAQ: ANSS) achieved certification of its cutting-edge multiphysics signoff solutions for TSMC’s advanced N3 and N4 process technologies. This enables joint customers to meet critical power, ...

Synopsys rolls out 'Multiphysics Fusion platform' for advanced AI chips

Synopsys ( SNPS) announced on June 17 the launch of its new Multiphysics Fusion platform, combining its AI-powered chip ...
Business Insider

Samsung Foundry Certifies ANSYS Multiphysics Simulation Solutions For Multi-Die Integration Advanced Packaging Technology

PITTSBURGH, Oct. 17, 2019 /PRNewswire/-- Samsung Foundry certified ANSYS (NASDAQ: ANSS) multiphysics simulation solutions for its latest multi-die integration TM (MDI ...
Nasdaq

Ansys Multiphysics Solutions Certified for Samsung Foundry's Entire Line of FinFET Process Technologies

Ansys achieved new certifications of its leading-edge suite of semiconductor design solutions for all Samsung Foundry FinFET process nodes Ansys® RedHawk-SC™ was added to the certified suite to design ...
Yahoo Finance

Ansys Thermal and Multiphysics Solutions Certified for Intel 18A Process and 3D-IC Designs

Ansys RedHawk-SC™ and Ansys Totem™ power integrity signoff platforms and Ansys HFSS-IC™ Pro electromagnetic simulation software are certified for Intel's 18A transistor process technology Ansys and ...
Stockhouse

Ansys, Intel Foundry Collaborate on Multiphysics Analysis Solution for EMIB 2.5D Assembly Technology

PITTSBURGH, Feb. 22, 2024 /PRNewswire/ -- Ansys (NASDAQ: ANSS) and Intel Foundry collaborated to provide multiphysics signoff solutions for Intel's innovative 2.5D chip assembly technology, which uses ...
EDN

ANSYS Introduces New Multiphysics Channel Partner Program

The ANSYS Elite channel partner program is designed to promote customer success by ensuring that channel partners meet stringent certification and resource requirements. While requirements vary by ...
VentureBeat

Ansys teams with Supermicro and Nvidia to speed multiphysics simulation up to 1,600X

Join our daily and weekly newsletters for the latest updates and exclusive content on industry-leading AI coverage. Learn More Ansys partnered Supermicro and Nvidia to deliver turnkey hardware, ...